Qinghe Jingyuan's first advanced semiconductor composite substrate production line in China is put into production

Qinghe Jingyuan recently successfully opened the first advanced semiconductor composite substrate production line in China. At the same time, the company completed a RMB 220 million A++ round of financing, with investors including Beijing Integrated Circuit Advanced Chip Fund, Sungrow Power Supply, Zhike Industrial Investment, Tianjin Tianchuang, etc. The company plans to meet the listing standards of the Science and Technology Innovation Board in 2026. Qinghe Jingyuan focuses on wafer-level material heterogeneous integration, advanced packaging, ultra-precision processing and other fields, providing cutting-edge technologies and solutions. The company has completed the research and development and mass production of a variety of bonding substrate materials such as SiC, LTOI, LNOI, and high-end wafer bonding equipment.