Powertech actively deploys advanced packaging technology

Powertech is actively deploying advanced packaging technologies such as panel-level fan-out packaging (FOPLP), CIS sensors, AI chips, CoWoS, etc. The benefits of these technologies have begun to gradually emerge. At present, the development and verification of related new products are being actively promoted. Powertech CEO Xie Yongda said that although the recovery of consumer and automotive products in the fourth quarter remains to be seen, the demand for application products such as AI and data centers will continue to grow, and revenue is expected to achieve a single-digit percentage growth this year.