Chongqing Xinling Microelectronics Co., Ltd. is about to put into production a 6-inch wafer line to meet the domestic demand for high-end power semiconductor chips

Chongqing Xinling Microelectronics Co., Ltd. is located in Building A of the Electronic Information Standardization Factory in Fuling High-tech Zone (Comprehensive Bonded Zone). It plans to complete the construction of a domestic leading specialty process wafer production line by the end of September. The company has a registered capital of 200 million yuan and an investment of about 2 billion yuan. It is expected to produce 1.2 million 6-inch power semiconductor specialty process wafers annually. The main products include power semiconductor chips such as IGBT and MOSFET, which are used in new energy vehicles, smart grids, photovoltaic energy storage, wind power generation, industrial applications, white appliances and other fields.