Jiejie Microelectric's 8-inch power semiconductor device chip project signed and settled in Suxitong Science and Technology Industrial Park

Jiejie Microelectronics announced that its 8-inch power semiconductor device chip project has been successfully signed and settled in the Suxitong Science and Technology Industrial Park. The project will be settled together with the Tongfu Microelectronics advanced packaging project. So far, the cumulative total investment of Jiejie Microelectronics and Tongfu Microelectronics in the Suxitong Science and Technology Industrial Park is nearly 15 billion yuan.