Agnit GaN layout progress and future planning

Agnit initially focused on the radio frequency (RF) field and then expanded to the power device market. In the field of gallium nitride, Agnit uses completely independently developed gallium nitride technology and does not rely on imported technology. To support device development, Agnit currently performs chip packaging internally and plans to outsource the packaging process to a mature local supply chain in India after entering mass production. In addition, Agnit is actively seeking global partnerships to leverage global gallium nitride chip packaging capacity. In addition to producing gallium nitride devices, Agnit also provides the supply of gallium nitride epitaxial wafers. As production capacity increases, Agnit plans to expand gallium nitride epitaxial wafers to the global market and establish foundry partnerships with chip manufacturers.