Hello, I would like to ask whether SanDisk Semiconductor, which your company plans to acquire, has 3D stacking packaging technology and can perform packaging testing for HBM products.

Changdian Technology: Dear investors, hello. SanDisk Semiconductor is mainly engaged in the packaging and testing of advanced flash memory products, including iNAND flash memory modules, SD and MicroSD memories. Thank you for your attention and support to the company.