Could you please tell us about your company's current mass production and cooperation status in advanced packaging of HPC chips? Thank you.

Changdian Technology: Changdian Technology Group has been cooperating with many customers in the advanced packaging of computing chips, and has provided customers with mass production support for many years, accumulating mature process and technical capabilities and mass production experience. The global high-performance computing market is currently growing rapidly, and more and more customers are entering this field, which requires leading packaging and testing manufacturers to provide them with advanced packaging and testing services. Changdian Technology is also expanding cooperation with different customers, strengthening capacity construction, continuously improving related advanced packaging technologies and expanding product applications, and providing customers with more diversified solutions.