Hongwei Technology's subsidiary Core Dynamic Energy Semiconductor has become the second domestic

Changzhou Xindongneng Semiconductor Co., Ltd. has successfully produced the one millionth automotive-grade electric drive double-sided heat dissipation plastic-encapsulated module, which marks that the company has become the second domestic company capable of mass-producing such high-end semiconductor products. The module uses advanced double-sided welding and double-sided heat dissipation technology, is compatible with IGBT and SiC MOSFET chips, reduces parasitic inductance to 6~8nH, and reduces thermal resistance by 30% compared to traditional single-sided indirect water cooling. In addition, it has passed all levels of reliability testing, including 50K times of rigorous testing under ΔTj=115℃. The electrical and thermal characteristics and reliability of this module can meet the market demand for motor controllers within 200KW.