Which technologies of the company are at the leading position in the industry?

Changdian Technology: Dear investors, hello. The company has top packaging technology and R&D capabilities, strong engineering R&D capabilities and diversified high-tech patents. The company has industry-leading advanced semiconductor packaging solutions, and is in the international leading position in the packaging process technology capabilities in the fields of power amplifier and RF front-end SiP, high and low frequency RF interconnect modules, wafer-level rewiring bump technology, fan-in and fan-out wafer-level packaging, fcCSP and PoP packaging, large-size MCMfcBGA packaging, high-density ultra-thin 3D stacked chip WB storage packaging, high-density WBBGA/LGA, high-density wiring type metal frame LGA packaging and silicon photonic packaging. The "Key Technology and Complete Process of High-Density and High-Reliability Electronic Packaging" project in which the company participated won the "First Prize of National Science and Technology Progress in 2020". Thank you for your attention and support.