Does the company have a business layout for third-generation semiconductors and what technical capabilities does it have? Is it currently shipping related products?

Changdian Technology: Dear investors, hello. The company has continued to strengthen its technological investment in the field of power semiconductors for many years, and has a comprehensive range of power product packaging shapes and process categories. The high-density integration solution for third-generation semiconductors jointly developed by the company and leading global customers integrates a variety of packaging technologies to reduce parasitic inductance interference and reduce the parasitic resistance of the package, thereby improving the overall power conversion efficiency and the heat dissipation capacity of the package. The company's packaged third-generation semiconductor devices have been used in automobiles, industrial energy storage and other fields and have entered the stage of capacity expansion. It is expected that the revenue scale of related products will increase significantly from 2024 and will grow significantly in the next few years, which will help promote the rapid increase in the volume of third-generation semiconductor devices in the global application market. Thank you for your attention and support.