Recently, domestic manufacturers have achieved breakthroughs in high-end RF modules and stated that RF demand will increase significantly in the second half of the year. What is the company's technical layout in the RF packaging field? What are its technical advantages? Will it benefit from the recovery of domestic manufacturers' RF market demand and breakthroughs in the high-end market?

Changdian Technology: Dear investors, hello. The company has laid out high-density system-level packaging SiP technology in advance, and has cooperated with multiple international high-end customers to complete the development and mass production of multiple 5G RF modules, which has been highly recognized by customers and the market. At the same time, the company is also the main packaging supplier for leading domestic RF customers, and can fully benefit from the recovery and continued growth of related market demand. Recently, relying on its own accumulation of SiP packaging and testing technology and mass production capabilities, Changdian Technology has taken the lead in developing a high-density heterogeneous integrated SiP solution for 5G RF power amplifiers for domestic customers, and will put it into large-scale mass production in domestic factories. The solution can integrate power amplifiers, low-noise amplifiers, RF switches, tuners, filters and other components according to product requirements. Compared with the previous generation of RF integration solutions, we have successfully increased the density of the module to 1.5 times that of the previous generation of products; at the same time, the use of back metallization technology effectively improves the EMI shielding of the module. At the same time, we also see that SiP packaging technology is rapidly penetrating into smart wearables, smart homes, industrial automation and large computing systems. The company will continue to launch SiP chip finished product manufacturing and packaging and testing solutions corresponding to the application to help customers achieve higher performance, functions and processing speeds, while significantly reducing the space requirements inside electronic devices. Thank you for your attention to the company.