Does your company have the packaging technology for chip thermal conductive materials?

Changdian Technology: Dear investors, hello. According to the different application types and product characteristics on each packaging technology platform, the company has developed corresponding chip thermal conductive material technology and has the mass production capabilities and experience of related packaging products. In terms of finished product manufacturing technology, we apply chip backside metallization technology to advanced packaging to significantly improve system thermal conductivity. The backside metallization technology developed by Changdian Technology can not only improve the heat dissipation of the package, but also enhance the electromagnetic shielding capability of the package according to design needs. The company has applied chip backside metallization technology and its manufacturing process to high-volume mass production lines. Thank you for your interest in the company.