Your company announced the achievement of 4-nanometer chip packaging in July last year. It is understood that TSMC and Samsung both started mass production of 3-nanometer chips at the end of last year. What is the development progress of your company's 3-nanometer process chip packaging technology? What is the technical difficulty? Thank you!

Changdian Technology: Dear investors, hello. The company has been cooperating with the world's leading wafer foundries on advanced process silicon nodes and continues to advance to more advanced nodes. The technical difficulty of advanced process packaging mainly lies in the stress, reliability and heat dissipation integration of chips and packaging, as well as the protection of chips during the process. Thank you for your attention and support to the company.