Currently, Tongfu Microelectronics' chiplet products have been mass-produced. May I ask if Changdian Technology's chiplet-related products have been mass-produced? What is the current proportion of chiplet-related products compared to other products? Thank you

JCET: Dear investor, thanks to the long-term experience and patents accumulated by STATS ChipPAC, a wholly-owned subsidiary of the Group, in chiplet-related technical fields, JCET has accumulated rich experience in large-scale mass production in recent years through high-density integration of multiple small chips under the chiplet architecture through domestic production subsidiaries; at the same time, the production introduction of ultra-high-density packaging and integration of small chips below 5 nanometers for international customers is also progressing smoothly. JCET also has the experience in large-scale mass production and testing of back-end ultra-large-size FCBGA packaging, which is essential for supporting chiplets, as well as the 16-layer chip ultra-thin stacking and interconnection technology capabilities for high-speed memory chips, making full process technology preparations for the future fast-growing heterogeneous integration market of computing and storage chips, ensuring that the relevant technology and production and manufacturing experience are in a leading position among domestic and foreign peers. Thank you for your attention to the company.