May I ask, is it true that the chips of other chip manufacturers are packaged into finished integrated chips? That is, your company does not have the ability to manufacture chips, but only has low-end production capabilities for processing and assembly, that is, it does not have its own intellectual property rights.

Changdian Technology: Hello, in the post-Moore era, the accelerated popularization of emerging technologies and applications such as 5G, artificial intelligence and the Internet of Things has put forward higher requirements for chip performance, integration and support for customization. The industrial upgrading trend of integrated circuit packaging and testing technology from advanced packaging to chip finished product manufacturing is becoming increasingly obvious. As a component of the manufacturing industry, the technical content of the packaging and testing industry has developed to a level that is gradually comparable to wafer manufacturing in the past two years, which has also promoted the industrial value upgrade of chip finished product manufacturing. Chip finished product manufacturing technology is gradually evolving from the previous "sealing" and "assembly" to advanced packaging and testing based on "dense" and "interconnection", becoming an indispensable technical support for promoting the sustained and rapid development of the integrated circuit industry. The company currently has more than 3,200 patents, ranking second among global semiconductor packaging and testing companies; among them, there are more than 2,400 invention patents (nearly 1,500 patents obtained in the United States). Among these US patents, more than two-thirds are related to advanced packaging such as wafer-level and flip-chip technology. Changdian Technology will seize the initiative in this regard by relying on its world-leading technology and patent layout and accumulation in chip finished product manufacturing combined with the world's top customer base. Thank you!