Hello, Secretary Dong, what is the current progress of your company's "Annual production of 3.6 billion high-density system-level packaging modules" project? Has the company's current production been affected by the chip shortage in the market, resulting in a reduction in packaging and testing business? In the face of the chip shortage, has the company followed the market and raised prices? Thank you.

Changdian Technology: Hello, the annual production of 3.6 billion high-density integrated circuits and system-level packaging modules has started small-scale trial production. The company's current orders are stable, and the capacity utilization rate is full. There is no reduction in packaging and testing business. The company will adjust the structure and price of some products based on the capacity allocation and changes in raw material prices. Thank you!