Hello, Mr. Dong, your company's "Annual production of 3.6 billion high-density system-level packaging modules" project successfully capped the factory building in July last year, and the factory building is scheduled to be delivered and put into use in January this year. Has the production equipment been put into operation? When is the production planned to start?

Changdian Technology: Hello, at present, the annual production of 3.6 billion high-density integrated circuits and system-level packaging modules has started small-scale trial production. The overall progress is in line with the company's expectations. The specific production progress will depend on the actual needs of customers and the actual availability of equipment. Thank you!