Samsung Electronics begins supplying state-of-the-art HBM3E memory to major customers

Samsung Electronics revealed during its third-quarter earnings conference call on October 31 that they have begun supplying HBM3E, the most advanced high-bandwidth memory, to a large customer. Kim Jae-jun, vice president of Samsung's storage division, said that the 8-layer and 12-layer stacked HBM3E has begun mass production and shipment, and has completed a key verification process for a major customer. Sales in the fourth quarter are expected to further expand.