Glass substrates meet the needs of high-performance applications

The emergence of glass substrates meets the industry's huge demand for high-performance applications such as artificial intelligence and its stringent requirements, including further reducing the size and spacing of through glass vias (TGV). Until now, organic substrates have used plated through hole (PTH) type vias, but these vias cannot meet these challenging requirements. With the advent of glass-core substrates replacing organic substrates, various processes that hitherto required basic printed circuit board (PCB) technology are entering a new stage of significantly increased complexity.