Hantian Tiancheng completes Pre-IPO financing and accelerates the construction of 8-inch silicon carbide epitaxial wafer production line

Xiamen Industrial Investment and two ICBC AIC funds jointly assisted Hantian Tiancheng Electronic Technology (Xiamen) Co., Ltd. in completing its current round of Pre-IPO financing. The success of this financing enabled Hantian Tiancheng to accelerate the construction of 8-inch silicon carbide epitaxial wafer production lines in Xiamen to meet the growing needs of domestic and foreign customers. Hantian Tiancheng is a world-leading provider of wide bandgap semiconductor (third-generation semiconductor) epitaxial wafers, mainly providing research and development, production and sales services for silicon carbide epitaxial wafers.