Samsung Electronics plans to invest in semiconductor glass substrates for FOPLP process

According to Korean media reports, Samsung Electronics is considering investing directly in the company's own semiconductor glass substrates for FOPLP processes to improve its ability to compete with TSMC in the field of advanced packaging. Samsung Electro-Mechanics is developing glass substrates and has completed the construction of a pilot production line, with the goal of entering the commercial mass production stage from 2026 to 2027. According to the equity structure at the end of 2023 announced on Samsung Electro-Mechanics' official website, Samsung Electronics is the company's largest single shareholder, with a shareholding ratio of 23.7%.