Black Sesame Smart Launches BLink, a New Generation of Dual-Core Interconnection Technology

In order to meet the computing power requirements of different levels of autonomous driving, Heizhima Intelligent has launched a new generation of dual-chip interconnect technology BLink. BLink supports efficient C2C (Chip-to-Chip) technology for cache consistency interconnection, which can expand the computing power requirements to support larger-scale models and prepare for the long-term evolution of algorithms. Through BLink technology, the A2000 family of chips can achieve cross-chip deployment of a single OS software, support high-bandwidth C2C consistency connections, meet NUMA cross-chip memory access requirements, and simplify the difficulty of software development and deployment.