Pure Semiconductor and Xizhi Technology signed a strategic cooperation agreement on customized development of automotive SiC chips

Qingchun Semiconductor and Xizhi Technology recently signed a strategic cooperation agreement on the customized development of SiC chips for automotive electric drive power modules and power supply modules. Qingchun Semiconductor will provide technical support to Xizhi Technology to help it achieve innovative upgrades and performance improvements in the field of automotive SiC power modules. The two parties will jointly develop more advanced, more efficient and more reliable SiC solutions for new energy vehicles.