Xizhi Technology develops SiC DCM plastic package power module

Xizhi Technology has been developing SiC DCM plastic-encapsulated power modules since July 2022. It has currently been conducting PV tests on some customers and is expected to start mass production in the fourth quarter of this year. In addition, Xizhi Technology is also cooperating with international and domestic first-tier automotive customers to develop innovative OCDC plastic-encapsulated power modules, electric drive SiC plastic-encapsulated power modules, and OCDC SiC/GaN high-frequency power modules.