Huatian Group's investment project in Pukou is progressing smoothly

The cooperation between Huatian Group (Pangu Semiconductor) and Pukou District began in 2018, when Huatian Group invested 8 billion yuan to start the construction of the first phase of the Huatian Nanjing project. It took only 17 months from the start of construction to the commissioning. In 2021, Huatian Jiangsu was established and invested 9.95 billion yuan to start the wafer-level advanced packaging and testing production line project. At present, the main part of the project has been fully capped. In March of this year, Huatian Group added another 10 billion yuan of investment to lay out the Huatian Nanjing Phase II project. In just less than two months, Pangu Semiconductor, which is controlled by Huatian Jiangsu, successfully signed and landed. In the past 6 years, the cooperation between the two sides has continued to deepen, from traditional packaging to wafer-level packaging, and then to Pangu Semiconductor's high-density board-level fan-out packaging, a series of high-energy projects have been implemented one after another. Huatian Group has a strong development momentum, and its technological level shows the integration and symbiosis of industry and innovation, which strongly supports the full-type layout of products in the packaging and testing field of the integrated circuit industry in Pukou District.