It is reported that TSMC will receive more than 60 EUV lithography machines this year and next year, with related investment exceeding NT$400 billion

TSMC expects to receive more than 60 EUV lithography machines this year and next, with related investments exceeding NT$400 billion. These devices will be used to support the company's production needs to meet the needs of markets such as data centers. TSMC expects capital expenditures to reach US$32 billion to US$36 billion in 2025, a year-on-year increase of 12.5% ​​to 14.3%. This growth is mainly due to the company's R&D investment in the most advanced processes such as 2nm and its expectations for subsequent demand for 2nm.