Beijing Tongmei plans to raise 1.167 billion yuan to invest in multiple semiconductor material projects

Beijing Tongmei plans to raise 1.167 billion yuan in the IPO of the Science and Technology Innovation Board, mainly for gallium arsenide semiconductor material projects, indium phosphide (wafer) semiconductor material projects, semiconductor material research and development projects and to supplement working capital. Among them, the gallium arsenide semiconductor material project will expand production capacity to meet market demand. Beijing Tongmei achieved steady growth from 2019 to 2021, with operating income of 462.2268 million yuan, 583.1704 million yuan and 857.3452 million yuan respectively; net profit in the same period was -28.0635 million yuan, 60.2742 million yuan and 94.0345 million yuan respectively. The company is a world-renowned semiconductor material technology company, and its main business involves the research and development, production and sales of semiconductor materials such as indium phosphide, gallium arsenide and germanium. Its products are widely used in RF devices, optical modules, LEDs and other fields. Beijing Tongmei's customers include internationally renowned companies such as ams OSRAM, IQE, Meta, as well as domestic companies such as Sanan Optoelectronics and Changguang Huaxin.