Qualcomm Flex SoC promotes the development of cabin-driver integration

Qualcomm Flex SoC's first product, the 8775, is expected to be mass-produced this year, providing about 70T computing power, suitable for cabin-driver integrated design. Several Tier 1 manufacturers have signed cooperation agreements, and Nezha Auto was the first to announce the selection of 8775. After four years of development, Qualcomm's Ride intelligent driving platform has formed a complete spectrum from front-view integrated machines to supporting urban NOA. In particular, the 8650 and 8620 platforms have strengthened the price-performance label.