About Xingan Technology

Xingan Technology is a high-tech enterprise focusing on the design, development and manufacturing of wide bandgap semiconductor silicon carbide power chips and modules. It was established in September 2020 and is headquartered in Beijing. It has chip device production lines and module module R&D centers in Jiangyin and Shenzhen respectively. At present, Xingan Technology has launched dozens of MOSFET, SBD and module products in three voltage platforms of 650V, 1200V and 1700V. Single-tube devices include TO-220, TO-247, TO-252, TO-263, TOLL and other packaging forms. Module products include Econo-dual PIM, Econo-dual Half bridge, Easy Pack and other packaging, and can provide enterprise customization. The 1200V/80mΩ MOSFET device has passed the AEC-Q101 certification and reached the automotive-grade reliability standard. It also means that a number of MOSFET devices with lower on-resistance developed on this process platform have reached the level of automotive-grade reliability certification.