Samsung Electro-Mechanics and AMD collaborate to develop high-performance FCBGA substrates

Samsung Electro-Mechanics recently announced that it has cooperated with AMD to develop a high-performance FCBGA (flip chip ball grid array) substrate for hyperscale data centers. The investment in this substrate reached 1.9 trillion won (about 9.956 billion yuan). The packaging technology jointly developed by Samsung Electro-Mechanics and AMD can integrate multiple semiconductor chips onto a single substrate, which is crucial for CPU/GPU applications and can achieve the high-density interconnection required for hyperscale data centers. Compared with general computer substrates, data center substrates are 10 times larger and have 3 times more layers, and have higher requirements for chip power supply and reliability. Samsung Electro-Mechanics solved the warping problem through innovative manufacturing processes, ensuring a high yield rate in the chip manufacturing process. Kim Won-taek, vice president and head of strategic marketing at Samsung Electro-Mechanics, said that it will continue to invest in advanced substrate solutions to meet the changing needs of data centers and computing-intensive applications, and provide core value to customers such as AMD.