Intel's German wafer fab project delayed

Intel's wafer fab investment project in Germany has been continuously delayed due to environmental protection and subsidy issues. Despite the delay, projects in Germany and Poland are still continuing. In Germany, Intel is building a large factory complex with an investment of 30 billion euros in the first phase. In Poland, Intel plans to invest 4.6 billion euros in Wroclaw to build an advanced chip packaging plant, which will cooperate with the German factory: the latter will produce small chips and the former will package them.