Lingming Photonics releases a number of innovative products to promote the development of 3D imaging technology

Lingming Photonics has launched SiPM, single-photon imaging SPAD array chips, and multi-point and limited-point dToF chips and modules, and is continuously accelerating the application of products in smart cars, high-end mobile phones, robots, automatic control, human-computer interaction, smart homes, etc. In 2021, the company successfully completed the tape-out of 3D stacked SPAD array chips, and in 2023 developed the world's highest-pixel SPAD array chip.