U.S. Department of Commerce invests in advanced packaging technology to help Amkor expand production

The U.S. Department of Commerce announced that it has signed a preliminary memorandum of understanding with Amkor, a leading global OSAT company. The U.S. government will provide Amkor with up to $400 million in financial assistance and a $200 million loan under the Chips and Science Act. This move is intended to support Amkor's project investment in Peoria, Arizona, and is expected to create 2,000 jobs.