Hong Kong Science and Technology Parks signs a memorandum of understanding with Chinese chip company J-Square Semiconductor

Hong Kong Science and Technology Parks has signed a memorandum of understanding with Chinese mainland chip company Jiefang Semiconductor, aiming to build Hong Kong's first SiC 8-inch wafer fab and a new third-generation semiconductor R&D center. Jiefang Semiconductor has pledged to invest HK$6.9 billion in the project and plans to achieve an annual production capacity of 240,000 wafers by 2028.