Xinling Microelectronics Co., Ltd. is expected to reach full production in 2027

It is expected that after reaching full production in 2027, Xinling Microelectronics Co., Ltd. will produce about 1.2 million 6-inch wafers per year, which will help meet the urgent domestic demand for high-end power semiconductor chips. Xinling Microelectronics Co., Ltd.'s main products include power semiconductor chips such as IGBT and MOSFET, and its product applications will cover new energy vehicles, smart grids, photovoltaic energy storage, wind power generation, industrial applications, white appliances and other fields.