TSMC starts construction of first European factory in Germany

TSMC, the world's leading chip manufacturer, started construction of its first European fab in Dresden, Germany on August 20. The fab will use 28/22nm CMOS technology and 16/12nm FinFET process, with an initial monthly production capacity of about 40,000 wafers. TSMC Chairman Wei Zhejia will lead a team including hundreds of executives and employees to attend the groundbreaking ceremony.