SemiDrive Technology ducit Sinensium automotive-gradus chip forum, cumulativo portarentur excedentes 6 decies centena millia frusta.
BAIC Group
GAC Group
Nissan
Xinchi Technology
2024
BAIC
Honda
X9
Honda
chip
exemplar
bus
cockpit
bus
bus
via
Dongfeng Honda
Dongfeng Nissan
AI
AI
2024-09-03 22:31
418
Xinchi Technologia prima in viatore autocineto autocineto cokpito in Sinensi primo dimidium 2024. Nautae cumulatae suae X9 seriei cockpit chippis superaverunt 4 decies frusta, tegentes fere 40 massas productas exempla inter Chery, Changan, SAIC, GAC, BAIC, Dongfeng Nissan, Dongfeng Honda, etc. Praeterea, societatis automotivo-gradus MCU productorum etiam massae productae in fere 20 exemplaribus cinematographicis auctorum ut Specimen, Chery, Geely, et Changan fuerunt. Ut nunc, cumulativae naves Xinchi Technologiae plenae amplitudinis assulorum autocinetorum 6 decies centena milia superaverunt.
