Samsung Electronics and Yangtze Memory Technologies Sign 3D NAND Hybrid Bonding Patent License Agreement
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2025-02-26 08:30
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Samsung Electronics has reportedly reached an important cooperation agreement with Yangtze Memory Technologies Co., Ltd. to adopt Yangtze Memory Technologies Co., Ltd.'s 3D NAND hybrid bonding patented technology. This technology was first named "Xtacking" by Yangtze Memory Technologies Co., Ltd. about four years ago. Samsung will start using this technology from its product V10, especially in the new advanced packaging technology "hybrid bonding".
