Tyco Tianrun's Series D financing received support from industrial capital again

Tyco Tianrun's D round of financing received joint support from a major international semiconductor company and Oriza, and new investors also included old shareholder CM Ventures and new shareholder TCL Ventures. This round of industrial capital will further connect the company's entire industrial chain in silicon carbide wafer materials, device mass production and supply, and downstream large-scale applications, providing core support for achieving wider and larger market applications.