Siliconcool Technology completes strategic financing of RMB 100 million to promote localization of chip interconnect technology

Silicon Cool Technology recently completed a strategic financing of 100 million yuan, led by CRRC Capital, Woniu Capital and Wenxin Fund. The funds will be used to accelerate the commercialization of silicon carbide pre-sintering bonding equipment and advanced packaging HBM equipment. Founded in 2018, Silicon Cool Technology focuses on chip interconnection technology in multiple scenarios. Its silicon carbide pre-sintering bonding equipment has become the leader in domestic substitution in this segment. The company is developing silicon carbide pre-sintering thermal bonding technology with an accuracy of several microns, and it is expected to achieve a 1~2um TCB process in 2025. Silicon Cool Technology has reached cooperation with many well-known companies such as Ruchain, Ideal, Geely, Macromicro Technology, Infineon, Dongfeng Motor, and Huawei supply chain.