Saijing Semiconductor Product Introduction

Initiated and established by Saijing Technology Group in September 2019, it is committed to creating domestic IGBT products of international quality. It has independent R&D, design, and process manufacturing capabilities of internationally leading and domestically scarce IGBT, SiC chips and modules. Focusing on 750V to 1700V products, it is mainly aimed at electric vehicles, new energy power generation, industrial electronic control and other markets. The "Design Center" is located in Landsberg, Switzerland; the "Manufacturing Center" is located in Jiashan County, Jiaxing City, Zhejiang Province. The first phase of the manufacturing center covers an area of ​​34 acres and plans to build: 5 IGBT module sealing and testing lines and 2 silicon carbide MOSFET module sealing and testing lines. In 2021, the first IGBT module sealing and testing line will be completed and put into production, IGBT chips will be sold in batches, and IGBT modules will be mass-produced and sent to customers for testing.