Tianyu Semiconductor's two SiC epitaxial projects are expanding

Tianyu Semiconductor's two SiC epitaxial projects have reached the capping/expansion stage, further accelerating capacity expansion: Dongguan Ecological Park Plant: Phase I of the project is expected to start trial production in May this year, with a planned annual capacity of 170,000 pieces; Dongguan Songshan Lake Plant: The seventh expansion will add an additional 200,000 pieces/year of capacity. Headquarters and production and manufacturing center construction project: The planned investment is 7.67 billion yuan, with a total land area of ​​approximately 63,000 square meters and a total construction area of ​​approximately 220,000 square meters. The construction period is from 2023 to 2025. Three new plant buildings and supporting building facilities will be built to build a 1 million piece/year SiC epitaxial wafer production line. Phase I of the project will start trial production in May 2024. Overall, after the seventh expansion and renovation, Tianyu Semiconductor's Songshan Lake plant has a total investment of approximately 1.667 billion yuan, a total land area of ​​18,600 square meters, a total construction area of ​​26,100 square meters, a total of 121 epitaxial growth equipment, and a maximum annual capacity of 334,400 SiC epitaxial wafers. In the future, if the eco-park plant is successfully put into production, Tianyu Semiconductor's annual production capacity of SiC epitaxial wafers will increase to 1.3344 million pieces.