Ousiwei completed the first batch of tens of millions of Pre-A+ round financing

The dark horse in the automotive wireless SoC chip industry, Ousiwei, has completed the first batch of tens of millions of Pre-A+ round financing, which was invested by a fund jointly established by Jinding Capital and Kangxi Communication (688653). There will be many institutions following up in the future. The funds from this round of financing will be used to continue to invest in the technology research and development of ultra-wideband (UWB) and automotive millimeter-wave radar chips to provide security for accelerating the mass production of products. Ousiwei went against the current and completed a total of more than 100 million yuan in financing within half a year. The Pre-A round of financing completed at the beginning of the year was led by Lihe Capital, followed by Hefei Gaotou and Broadcom Integrated (603068). At present, Ousiwei's mass-produced UWB SoC products cover a variety of application scenarios such as IoT, mobile phones and automobiles, and have obtained fixed-point and batch shipments from many customers.