Lingming Photonics received tens of millions of yuan in C2 round financing

Jintou Dingxin, a subsidiary of Zhejiang Financial Holdings, completed its C2 round of investment in Lingming Photonics with an investment philosophy of focusing on core hard technology. The funds raised in this round will continue to be used for the rapid iteration and mass production of high-end 3D camera chip R&D. Lingming Photonics has launched SiPM, single-photon imaging SPAD array chips, and multi-point and limited-point dToF chips and modules, and is constantly accelerating the application of products in smart cars, high-end mobile phones, robots, automatic control, human-computer interaction, smart homes and other fields. In 2021, the company has successfully completed the tape-out of 3D stacked SPAD array chips. In 2023, it developed the world's highest-pixel SPAD array chip to achieve solid-state 3D camera imaging. The company's 905nm-based SiPM first broke the world record for PDE parameters by 25%, and passed the AEC-Q102 Grade 1 automotive-grade certification in 2023. The product performance meets the stringent performance and reliability standards of automotive-grade LiDARs, and has achieved stable and large-scale mass production and shipment by the end of 2023. Multi-point and limited-point products have continuously entered the supply chains of various leading manufacturers during the year, and the products have been continuously iterated and shipped in batches. ADS6311 is one of the ultra-high-resolution pure solid-state LiDAR SPAD array chips on the market. It is widely used in pure solid-state LiDAR fields such as vehicles and robots, and has been designated by many top technology manufacturers at home and abroad.