Resonac plans to start supplying SiC wafers and SiC epitaxial wafers in 2027

It is planned to start supplying SiC wafers (substrates) to Oyama City, Hikone City, and Higashine City in April 2027, with an annual production capacity of 117,000 pieces (equivalent to 6 inches). The supply of SiC epitaxial wafers to Ichihara City and Higashine City is planned to start in May 2027, with an estimated production capacity of 288,000 pieces per year (unchanged).