The rise of glass substrates in advanced packaging

The application of glass substrates in the field of advanced packaging is growing rapidly and has become a new focus of the semiconductor industry. Shenzhen Matrix Multi-Purpose Technology Co., Ltd., as a leader in this field, recently completed a B2 round of financing of 100 million yuan, accelerating its pace of R&D and capacity expansion in advanced packaging PVD mass production equipment. This financing not only shows that the capital market recognizes the prospects of glass substrate technology, but also indicates that this field is about to usher in more intense competition and development.