Rumors that TSMC's CoWoS advanced packaging capacity was cut by major customers were debunked

Recently, there have been market rumors that TSMC's CoWoS advanced packaging capacity has been cut by major customers, causing the average monthly capacity to drop to 62,500 pieces this year, lower than the original market expectation of more than 70,000 pieces. However, many industry insiders have refuted this rumor. A person in the packaging and testing supply chain said that recent CoWoS-related orders are still in short supply and have not been cut, which may be due to the process and generational shifts, or even the fact that some customers have begun to deploy the next generation of fan-out panel-level packaging (FOPLP), leading to misunderstandings.