Xcell Semiconductor Launches 3DIC Chiplet Multi-Physical Field simulatio Platform

Xinhe Semiconductor, "Chinese ANSYS" notus, nuper suum 3DIC Chiplet multi-physicum campi simulationis suggestum independenter evolvit. suggestum ad quaestiones inscriptionis destinatur ut insignem integritatem, virtutem integritatis, electromagnetici, caloris et accentus, adiuvans chip consilium campus ab uno-chip (SoC) ad multi-chi systemata moveatur.