Xingan Technology's 6-inch power semiconductor manufacturing project started

Xingan Technology's 6-inch power semiconductor manufacturing project has been launched. The total investment of the project exceeds 1 billion yuan. The first phase of construction includes 6-inch plant and other facilities. The construction of the wafer factory started in August 2023, and the equipment was officially moved in August 2024. Xingan Technology has completed the mass production of dozens of SiC devices and module products on voltage platforms such as 650V, 1200V, and 1700V, and some products have passed the AEC-Q101 automotive-grade reliability certification.