GAC Group releases 12 automotive-grade chips

GAC Group released 12 automotive-grade chips at the Technology Day event, including chips jointly developed with ZTE Microelectronics, Yutai Microelectronics, Renxin Technology, Silergy, Jihai, Eswi, Jewatt, Guoxin, Mattel and other companies. Among them, the C01 chip jointly developed with ZTE Microelectronics is my country's first independently designed new generation 16-core multi-domain fusion central computing processing chip; the G-T01 chip jointly built with Yutai Microelectronics is the first automotive-grade Gigabit Ethernet TSN switching chip with the highest capacity in China; the G-T02 chip jointly developed with Renxin Technology is the world's first SerDes chip with a bandwidth of up to 16Gbps; the G-K01 chip developed with Silergy is the world's first 6-core RISC-V chip that meets the ASIL-D functional safety level. The application scenarios of these chips cover multiple fields such as smart car power management, braking, and integrated safety.